• SAMSUNG SPI HS60

SAMSUNG SPI HS60

  • Our innovative 3D laser triangulation sensor, the RSCTM profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solder material, paste shape, and warpage.
  • This highest quality of 3D data backs up top level performance of SPI HS60 system concerning about the reliability and accuracy. This high performance is due to PARMI’s unique signal processing technology that is implemented as hardware logic.
  • By virtue of the affordable profiling speed of the 3D sensor, the SPI HS60 system provides 100% whole pads inspection in even fast assembly lines.

Share this product

SAMSUNG SPI HS60

  • Our innovative 3D laser triangulation sensor, the RSCTM profiles real shape of features and also provides highly robust 3D data against considerable variations of PCB color and finishing condition, solder material, paste shape, and warpage.
  • This highest quality of 3D data backs up top level performance of SPI HS60 system concerning about the reliability and accuracy. This high performance is due to PARMI’s unique signal processing technology that is implemented as hardware logic.
  • By virtue of the affordable profiling speed of the 3D sensor, the SPI HS60 system provides 100% whole pads inspection in even fast assembly lines.

screen frames icon Inspection Performance

  • Inspection Type : Height, Area, Volume, Offset, Bridge
  • Inspection Speed : High Resolution 30 sq.cm/sec
  • Load, Unload Time : 1 sec
  • Height Repeatability : 3 Sigma < 1.5 , on a certification target
  • Area Repeatability : 3 Sigma < 3%, on a certification target
  • Volume Repeatability : 3 Sigma < 3%, on a certification target
  • Height Accuracy : 3 , on a certification target
  • Gage R&R : Less than 10 %

pcb size icon

PCB Size

  • PCB Min Size: 50 * 50 mm
  • PCB Max Size: 390 * 260 mm
  • PCB Max Weight : 1.0 kg
  • PCB Thickness: 0.4 ~4 mm
  • PCB Warpage: ±5 mm
  • PCB Edge Clearance (Top/Bottom): 2.5 / 3 mm
  • Underside Clearance : 25 mm
  • Topside Clearance : 25 mm

details icon

Details

  • Measuring Principle : Laser Optical Triangulation
  • Paste Type Supported : All (Pb or Pb Free)
  • Board Type Supported : All colors and All pad finishes
  • Offline Teaching : GerberWorks
  • SPC & Process Monitoring : SPCworks
  • System Diagnosis : SPImanager
  • Conveyor System : 1 conveyor
  • X-Y-Z robot : Sensor head move in X-Y-Z Axis
  • Computer : Pentium IV 3.0GHz, 4GB Memory
  • Operating System : MS-Windows XP Professional
  • Display : 17″ LCD
  • Input : Mouse, Keyboard
  • Enclosure : Conforms to CE regulations
  • Supplies : AC 220V, 5 kgf/sq.cm
  • Conveyor Speed Range : 300 – 500 mm/sec
  • Conveyor Height : 890 – 940 mm
  • Flow Direction : Left Right or Right Left
  • Conveyor Reference Side : Selectable when ordering
  • Dimensions : 900 *1000 *1450 mm
  • Weight : 750KG

Hot-sales Products

Copyright © 2018 Shenzhen Morel Electromechanical Equipment Co., LTD. | All Rights Reserved | Designed by Nocti Solution